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Sep 19, 2007 at 04:37 PM |
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 Product Briefing Outline: Brion Technologies, an ASML company, has added significant options to two key product lines, Tachyon OPC+ and LithoCruiser. Combined with the recent shipments of high NA immersion scanners, Tachyon OPC+ version 7.06 and LithoCruiser version 2.2 are specifically designed to further enhance the accurate representation and optimization of today’s most advanced scanners for critical process development of memory and logic applications.
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Sep 13, 2007 at 04:00 PM |
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 Product Briefing Outline: Cymer has introduced the XLR 600i offering 90 watts of output power at the 193nm wavelength. The XLR 600i is the first 90W argon fluoride (ArF) laser light source designed to enable volume immersion and Double Patterning (DP) lithography at the 32nm node and beyond. The 6kHz XLR600i produces improved pulse energy stability, resulting in improved critical dimension (CD) control required for the most critical imaging layers at memory, logic and foundry chipmakers.
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Sep 11, 2007 at 04:28 PM |
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 Product Briefing Outline: Voltaire and Synopsys are developing a high-performance compute (HPC) cluster solution for semiconductor mask data-preparation (MDP) applications. The HPC solution, which consists of the Synopsys CATS MDP solution running on a high-performance compute infrastructure with Voltaire InfiniBand and DataDirect Networks’ storage, reduced MDP turnaround time by up to 4X compared to clusters using Gigabit Ethernet, according to the companies.
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Aug 21, 2007 at 03:27 PM |
 Product Briefing Outline: TEA Systems has announced the release of a new software product that enhances the control of overlay and registration in advanced semiconductor manufacturing to minimize the influence on critical feature dimensions and yield. Vector Raptor is a seventh generation overlay control tool specifically designed to address the unique problems now being introduced by Double Patterning and sub-45 nm process-node technology.Write Comment (0 comments) |
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Aug 17, 2007 at 11:51 AM |
 Product Briefing Outline: ASML has introduced a new KrF lithography system that is claimed to significantly reduce operating costs for its customers. The ASML TWINSCAN XT:1000 scanner has a numerical aperture (NA) of 0.93 that can resolve 80nm device features, far smaller than the 100nm of today's KrF systems, therefore extending cost-efficient KrF technology to resolutions that previously required more expensive ArF technology. ASML claims savings of 30 percent or more per layer as a result of lower operating costs for KrF technology, particularly from cheaper lasers and lower materials cost such as KrF resists.Write Comment (0 comments) |
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Aug 16, 2007 at 06:28 PM |
 Product Briefing Outline: Entegris, Inc. introduced an advanced bulk gas purification system that allows manufacturers to purify large volumes of purge gases used in dry and immersion-based lithography tools, an area of increasing importance as wafer lens sizes continue to grow. The Entegris Aeronex Gas Purification System (AGPS) Z2 series brings advanced contamination control technology to bulk gas purification. As part of the Entegris Clarilite solution, the AGPS will also help increase protection against reticle haze.Write Comment (0 comments) |
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Aug 16, 2007 at 12:30 PM |
 Product Briefing Outline: Nikon has launched the NSR-S310F 193nm ArF ‘dry' lithography scanner with projection optics at (0.92 NA) that combines technology advancements from leading-edge dry and immersion systems to provide a high productivity dry ArF scanner for critical applications at the 65nm node and below. The system uses Nikon Tandem Stage technology to increase throughput, improve overlay accuracy, and enhance long-term stability. With the throughput increased to 174 wafers per hour - a 20% increase over the previous generation Nikon scanner - cost of ownership is significantly reduced, according to the company. The Tandem Stage has also helped reduce overlay to 7nm.Write Comment (0 comments) |
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Jul 10, 2007 at 05:04 PM |
 Product Briefing Outline: Sokudo has launched its new RF3S coat/develop track system that delivers the technology and productivity requirements of 45nm-and-beyond immersion and dry lithography. The RF3S provides less than 0.8nm 3 sigma critical dimension (CD) uniformity and immersion defect density of less than 0.1 defects/cm2, according to the company.
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Jun 12, 2007 at 03:18 PM |
 Product Briefing Outline: Synopsys and Hitachi High-Technologies have developed a seamless link between Hitachi High-Tech's DesignGauge design data measuring system and Synopsys' Proteus optical proximity correction (OPC) solution. Focused on incorporating manufacturing-aware metrology data into design, this common design for manufacturing (DFM) interface assists in the development of faster, more accurate and predictive OPC models for advanced 45nm and beyond technologies. Higher OPC model predictability and reduced model-building cycle times are also achievable. This new functionality is available in the latest production release of Proteus.
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Jun 05, 2007 at 12:52 PM |
 Product Briefing Outline: Sagantec has launched a DFM solution for correcting lithography hot spots found in physical IC designs in collaboration with Mentor Graphics. The new DFM flow uses Mentor Graphics' ‘Calibre LFD' (litho friendly design) tool to analyze the design layout and detect lithography hot spots. Sagantec's DFM-Fix tool uses the Calibre LFD analysis results to correct hot spots and optimize the overall layout, which is then verified by Calibre LFD. Sagantec claims that DFM-Fix is the first product that solves the lithography-related "hot spot" problem at the root, by correcting the design data.
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Lithography 
