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Jul 10, 2007 at 05:04 PM |
 Product Briefing Outline: Sokudo has launched its new RF3S coat/develop track system that delivers the technology and productivity requirements of 45nm-and-beyond immersion and dry lithography. The RF3S provides less than 0.8nm 3 sigma critical dimension (CD) uniformity and immersion defect density of less than 0.1 defects/cm2, according to the company.
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Jul 10, 2007 at 04:42 PM |
 Product Briefing Outline: Asyst Technologies has announced the introduction of its Factory Data Integration Manager (FDIM). FDIM offers fab engineers a dynamic, adaptable interface for tool data access that overcomes the difficulties often experienced when implementing data collection using existing station controller technologies.
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Jul 09, 2007 at 02:41 PM |
 Product Briefing Outline: KLA-Tencor Corporation has claimed that its new resolution surface topography profiling system, the ‘HRP-350,' is the most advanced in the industry and can extend critical measurement capability to the 45nm semiconductor device generation. The HRP-350 system offers chipmakers the ability to monitor significantly smaller lateral and vertical dimensions. These breakthroughs are matched by higher scan speeds that elevate the system's production worthiness across a wide range of critical transistor and interconnect applications. The company claimed an installed base of over 500 HRP-series systems as well as more than 4,000 desktop tools, which are extensively used by fabs, universities, and research facilities, according to the company.
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Jul 05, 2007 at 02:48 PM |
 Product Briefing Outline: Ferro Electronic Material Systems has introduced a patent-pending self-stopping chemical mechanical planarization (CMP) slurry for Inner Layer Dielectric (ILD) materials. Ferro claims the new slurry provides planarization efficiency of > 95% with an increased over-polish window and eliminates the need for endpoint detection. ‘SureStop' 8500 offers improved efficiency and uniformity with lower defectivity compared to standard ILD CMP slurries and is now being used to simplify planarization processes that employ reverse mask etchback steps.
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Jul 05, 2007 at 02:36 PM |
 Product Briefing Outline: Advanced Energy Industries has introduced its latest power platform: the ‘Paramount' RF-power delivery system. A key aspect of the new platform is power-delivery accuracy and control for increasingly complex film stacks and fine feature sizes. The 3kW Paramount system is well suited for both etch and deposition processes in semiconductor, FPD, MEMS and solar photovoltaic manufacturing.
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Jul 04, 2007 at 04:05 PM |
 Product Briefing Outline: Tevet Process Control Technologies has introduced a patent pending parallel sensor Integrated Metrology Module (IMM). The company claims it has best-in-class two second per wafer measurement cycle that is the only production proven IMM that can measure every wafer in the fastest CVD processes.
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Jul 04, 2007 at 03:01 PM |
 Product Briefing Outline: KLA-Tencor has launched into the advanced wafer defect review and classification market with the introduction of the ‘eDR-5200' system. The new tool has been designed to seamlessly integrate KLA-Tencor's inspection tools with the eDR-5200 to enable fabs at the 45nm node and beyond to produce a greater number of higher quality defect Paretos per hour, allowing engineers to take rapid, accurate corrective action to protect yields, according to the company. The eDR-5200 has been shipped to customers in Asia, Europe and the U.S., where it is being installed for both memory and logic applications.
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Jul 03, 2007 at 02:20 PM |
 Product Briefing Outline: VLSI Standards, Inc. has announced the release of its Edge Contamination Standards (ECS) product line. These NIST-traceable calibration standards will allow users to calibrate, characterize and monitor Scanning Surface Inspection Systems (SSIS) that detect and size particles on the substrate's edge.
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Jun 28, 2007 at 05:10 PM |
 Product Briefing Outline: Novellus Systems has introduced a new patent-pending ashable hard mask (AHM) process technology on the ‘VECTOR Express' plasma-enhanced chemical vapor deposition (PECVD) platform. The technology has been designed to address the challenges in advanced technology nodes that utilize 193nm lithography for high aspect patterning etch, where thinning photoresist material makes it difficult to extend conventional patterning. Novellus has already delivered tools with this new capability to major memory manufacturers.
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Jun 28, 2007 at 12:42 PM |
 Product Briefing Outline: KLA-Tencor launched its latest range of tools to the 28xx brightfield inspection platform, featuring specialized optical configurations intended to solve the unique defect detection challenges of sub-55nm memory and sub-45nm logic chips. Both the 2810 system for memory devices and the 2815 system for logic use the full-spectrum illumination technology that is designed to capture the broadest possible range of defect types, including yield-critical immersion lithography defects. The system's production throughput at sensitivity has more than doubled for many applications, compared to the previous 2800 system.
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Jun 28, 2007 at 10:50 AM |
 Product Briefing Outline: Purafil has introduced its 2nd Generation MediaPAK Disposable Plastic Module for clean air filtration systems. The module features the new Taper Fit Closure (TFC), which offers a quick-connect positive mechanical seal providing a leak-free zone. The TFC appears on each side of the module. When two or more modules are adjacent within the application, the TFCs unite to form a positive connection or seal.
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Jun 25, 2007 at 02:46 PM |
_100.jpg "Image") Product Briefing Outline: Lam Research has launched the 2300 Motif post-lithography pattern enhancement system that uses a proprietary plasma-assisted process. The new system delivers controlled photoresist hole and space CD shrinks of up to 100nm, creating features as small as 10nm, demonstrating extendibility to the 22nm node and beyond. According to the company, competitive post-lithography pattern enhancement systems are typically limited to shrinks of less than 30nm. The system was developed in collaboration with IMEC.
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Jun 22, 2007 at 10:04 AM |
 Product Briefing Outline: Ferro Electronic Material Systems has formulated patented high selectivity shallow trench isolation (STI) CMP slurries with an optimized low defectivity ceria particle that enable high-yield processes for next-generation devices. ‘TruPlane™ 8272' is performing successfully in high-volume manufacturing of 65nm technology Flash devices, according to the company.
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Jun 21, 2007 at 06:29 PM |
 Product Briefing Outline: MKS Instruments has introduced the ‘CONTINUUM' Universal Industrial Network Gateway with ‘cLogic' and the ‘MacroNode' I/O Controller with EtherCAT interface. These new solutions offer more precise process control through faster network performance and improved web browser diagnostics, according to the company.
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Jun 19, 2007 at 02:24 PM |
 Product Briefing Outline: FEI has launched the V600CE - a new member of its V600 focused ion beam (FIB) family of circuit edit tools. The V600CE is claimed to enable faster semiconductor design validation and performance optimization on today's 65nm-and-below devices due to its advanced ion column technology, versatile gas delivery system, and advanced end-pointing control.
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Jun 19, 2007 at 12:49 PM |
 Product Briefing Outline: KLA-Tencor has revealed its latest advancement in darkfield patterned wafer inspection technology in the Puma 9150 system. The tool features new optical modes that enable capture of a broader range of yield-critical defects for 45nm production while providing the highest available darkfield production throughputs, reducing operating cost and allowing higher sampling rates for tighter process control, according to the company. KLA-Tencor has shipped Puma 9150 systems to memory and logic customers in all chipmaking regions, including multiple systems to several fabs. The system is being used for 65nm production, 45nm ramp, and sub-45nm R&D.
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Jun 18, 2007 at 10:00 AM |
 Product Briefing Outline: Hach Ultra has introduced its ORBISPHERE 510 instrument with the capability of connecting TC sensors for process control monitoring. The instrument offers multi channel capability for both thermal conductivity sensors measuring H2 or N2 and for electrochemical sensors measuring O2. This complete system is designed for process monitoring in liquid or gas phases across a wide range of applications for the electronics industry.
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Jun 18, 2007 at 09:39 AM |
 Product Briefing Outline: Cabot Microelectronics has claimed a major breakthrough in its CMP technology with the ‘WIN' platform of tungsten (W) CMP slurries for advanced technology nodes. The WIN product line is non-hazardous and environmentally friendly as it is based on hydrogen peroxide technology. The product platform is composed of two main product classes: ‘WIN W7000' and ‘WIN W7300.'
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Jun 14, 2007 at 11:06 AM |
 Product Briefing Outline: FEI Company has launched its next-generation tool in the product family, the DualBeam Expida 1255S system, which is claimed to be the first and only wafer DualBeam system to integrate wafer level STEM (scanning/transmission electron microscopy) sample preparation with ultra-high-resolution imaging and analysis in a single tool. The Expida 1255S features an advanced ion beam column for preparing TEM samples, and an enhanced electron column with a 14-segment STEM detector for high-resolution 30kV imaging to support advanced manufacturing process at the 45nm node and beyond.
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Jun 12, 2007 at 03:18 PM |
 Product Briefing Outline: Synopsys and Hitachi High-Technologies have developed a seamless link between Hitachi High-Tech's DesignGauge design data measuring system and Synopsys' Proteus optical proximity correction (OPC) solution. Focused on incorporating manufacturing-aware metrology data into design, this common design for manufacturing (DFM) interface assists in the development of faster, more accurate and predictive OPC models for advanced 45nm and beyond technologies. Higher OPC model predictability and reduced model-building cycle times are also achievable. This new functionality is available in the latest production release of Proteus.
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Product Briefings 
Product Briefing Outline: Applied Materials has launched its Applied Producer ‘ACE' SACVD system. The system is designed to extend 193nm lithography using self-aligned double patterning (SADP) schemes, Applied's ACE system is claimed to deliver a highly conformal oxide spacer film with >95 percent step coverage, <5 percent pattern loading and <1 percent non-uniformity, enabling state-of-the-art critical dimension control. Combined with a benchmark throughput of >80 wafers per hour and a low thermal budget, the ACE system extends spacer solutions for SADP to the 32nm node and beyond. 
