Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home
More numbers games: Combining SEMI's equipment, materials market revenue reports Print E-mail
Mar 31, 2008 at 05:01 PM
SEMI released its report of the 2007 worldwide semiconductor equipment market revenue results last week, while its numbers for the materials side of the business hit the wires earlier today.Write Comment (0 comments)
Semi trade mag editorial musical chairs: Singer leaves SI to helm SST, Peters takes over SI Print E-mail
Mar 26, 2008 at 04:07 PM
A couple of big changes at the top of the editorial staffboxes of the two leading US-based semiconductor trade magazines have shaken out this week.

In a shocker, Pete Singer, editor in chief of Semiconductor International (SI) for some 25 years, jumped ship last week, landing at archcompetitor Solid State Technology (SST) this week, where he will take over the reins.Write Comment (8 comments)
Take a deep breath: IC Insights offers calm advice amid the gathering recessionary storm Print E-mail
Mar 25, 2008 at 09:59 AM
The possibility of a US recession has become less of a threat and more of a reality faster than you can say "Bear Stearns." But to link such macroeconomic doom and gloom to the likelihood of a semiconductor industry downturn may be premature, according to IC Insights.Write Comment (1 comments)
Atomate's Lim talks about company's expansion of DIY CVD product line Print E-mail
Mar 20, 2008 at 02:29 PM
Since first visiting the Atomate team at their new Simi Valley, CA, facility last July, I've stayed in touch with the up-and-coming nanotube/nanowire synthesis process, tool, and component company's CEO/president/chairman/cofounder/head cheerleader, Brian Lim.Write Comment (0 comments)
IMEC, JSR work on freezing agent as part of cost-effective double-patterning solution Print E-mail
Mar 19, 2008 at 12:45 PM
Advanced chipmakers have a dilemma: To pattern 32-nm half-pitch devices (let alone those 22-nm itty bitties), plain-wrap, single-exposure ArF immersion lithography doesn't have the legs to get it done.Write Comment (0 comments)
Don't get excited: Despite Lam's acquisition of SEZ, little has changed...yet Print E-mail
Mar 19, 2008 at 11:22 AM
If you look at the Websites for Lam Research and SEZ, you'd hardly know the two companies are now one, despite the successful closing of the tender-offer deal last week.Write Comment (0 comments)
GE Global Research brings no new things to light after initial OLED R2R project news Print E-mail
Mar 17, 2008 at 01:17 PM
GE Global Research received a decent amount of coverage last week from its press release touting the "successful demonstration of the world's first roll-to-roll manufactured organic light-emitting diode (OLED) lighting devices" at the unit's Niskayuna, NY, R&D center.Write Comment (1 comments)
Solar startup Stion plans move to San Jose, remains stuck in stealth mode Print E-mail
Mar 14, 2008 at 03:17 PM
The Edenvale area of San Jose is becoming a little hotbed of photovoltaic activity, but the latest company set to move there remains in stealth-mode information lockdown.Write Comment (0 comments)
Tronics, Europractice's first MPW MEMS partner, talks about thick SOI metrology challenges Print E-mail
Mar 11, 2008 at 12:54 PM
As one of the premier purveyors of MEMS fabricated on thick silicon-on-insulator (SOI) wafers, Tronics Microsystems knows a thing or two about the metrology challenges involved with those fat, bonded substrates.Write Comment (0 comments)
Random photons, scattered electrons, and cathartic rantings from SPIE and beyond Print E-mail
Mar 06, 2008 at 08:30 AM
When Micron announces fab plans, don't hold your breath.Write Comment (0 comments)
Techcet chimes in on what's driving the changes in advanced interconnect materials Print E-mail
Mar 05, 2008 at 08:30 AM
While the front end of line, lithography, and process integration areas often get the lion's share of attention in the advanced semiconductor manufacturing community, the back end of line presents its own prickly challenges and potential for bottlenecking.

The new edition of the ITRS lists three grand challenges associated with the interconnect realm: In the near term (through 2015, or up to but not including 22 nm), new materials will be needed to meet the specs for both high conductivity and low dielectric permittivity and the structures, processes, and aforementioned new materials must be engineered to be manufacturable.Write Comment (0 comments)
Bedside reading: Entire ITRS report finally available (at least most of it) for download Print E-mail
Mar 04, 2008 at 03:07 PM
A couple of weeks ago, when I went to download a copy of the executive summary from the latest (AKA 2007) edition of the International Technology Roadmap for Semiconductors, I noticed that the entire document was still not posted to the site.Write Comment (0 comments)
Applied Materials focuses its litho-enhancement hopes on self-aligned double patterning Print E-mail
Mar 03, 2008 at 08:45 AM
Applied Materials claims it has a great lithography-enabling technology with its self-aligned double patterning (SADP) approach.Write Comment (1 comments)