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Toshiba to relocate Thai operations to new semiconductor facility

24 April 2012

Toshiba's Thai operations ground to a halt last year as floods devastated the countryToshiba has announced it will build a new production facility to relocate its semiconductor operations and redress the problems caused by the 2011 floods and to meet future growth demands. The plant, which will be operated by subsidiary Toshiba Semiconductor Thailand Ltd (TST), will be 135,000 square metres and be due for completion in the spring of 2013, production will begin in the subsequent months.

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Amkor to purchase Toshiba‚??s Malaysian IC assembly and test operations

30 September 2011
Toshiba said it would continue to subcontract power semiconductor assembly and test to its former Malaysian IC assembly and test operations after being acquired by Amkor. Toshiba and Amkor expect to complete the transaction by early January 2012. Read more >>

IDT completing fablite to fabless business model with Oregon fab sell

30 August 2011
Mixed-signal IC fabrication specialist, Integrated Device Technology (IDT) is moving to the fabless business model with the sale of its Hillsboro, Oregon wafer fabrication facility. However, the fab is not to close but is being acquired by Alpha and Omega Semiconductor, which under a foundry service arrangement with IDT AOS has the option to acquire the wafer fabrication facility and related assets for US$26 million. Read more >>

Product Briefings

New Product: Applied iSYS fully-integrated abatement and vacuum pumping solution reduces energy use

02 December 2009
Product Briefing Outline: Applied Materials has unveiled its ‘Applied iSYS’ platform, the industry’s first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. Networked with an Applied process tool, the iSYS system can deliver typical annual savings in power, water and gas consumption equivalent to 200MWh of energy or 220,000 pounds of CO2 emissions, compared to currently available configurations. In addition to having environmental benefits, the iSYS system lowers the utility cost for abatement and vacuum pumping on a process tool by more than 20%. Read more >>

New Product: Tiger Optics’ gas phase AMC analyzer measures parts per trillion trace levels

15 January 2009
‘Tiger-i’ cleanroom analyzer for gas phase airborne molecular contaminantsProduct Briefing Outline: Tiger Optics has introduced the ‘Tiger-i’ cleanroom analyzer for gas phase airborne molecular contaminants (AMCs). The Tiger-i line employs Tiger Optics’ patented Continuous Wave Cavity Ring-Down Spectroscopy (CW-CRDS) technology that is claimed to provide accurate and immediate, calibration-free analysis. Read more >>

Top 5 new products for 2008

29 December 2008
TeraFabOne of the equipment suppliers that consistently brings out new products is KLA-Tencor. However, the metrology supplier rarely figures in the most popular rankings in any given year. That has changed in 2008 with its TeraFab tool. Although only released recently, the fifth most popular product was from TEL and Novellus for copper interconnects. Read more >>

White Papers

Edition 38: Chiller plant optimization

21 January 2009

FT38By Terrence Morris & Steve Blaine PE, CH2M HILL, Oregon, USA

Outside of the process tools themselves, the chilled water plant is typically the single largest consumer of electrical energy in a semiconductor facility. This load includes not just chillers but also cooling tower fans, primary pumps, secondary pumps and condenser pumps. In order to meet the cooling requirements for any particular heat load, many different combinations of this equipment can be run. However, electricity consumption varies considerably depending on the combination of equipment used and the operating levels of the individual components. Selecting the optimal mix of equipment and operating levels presents a substantial challenge for an automatic control system and plant operators. Typically, no method is available to predict the effect of interactions and variations in load demand and outside air. This makes it challenging, if not impossible, to find an equipment mix that achieves optimal energy use. In response to this challenge, we set out to create a model/tool that would allow operators to automatically determine the optimal equipment mix to satisfy cooling requirements and minimize energy use. This paper describes how this model was created and how it works.

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Point-of-use abatement of tool exhaust emissions: a technology overview

01 September 2007
Walter F. Worth, International SEMATECH Manufacturing Initiative, USAa Read more >>

New cooling water control technology facilitates fabs‚?? water reuse strategies

01 April 2007
By Jay Duncombe, Intersil; Eric Madera, Linear Technologies; John Brooks, Daniel Cicero, Dr. Steven Hatch, Brian Jenkins, Kevin Olson and Barry Carroll, Nalco Company Read more >>