Applied Materials has become the newest member of the Environment, Safety and Health (ESH) Technology Center, part of International SEMATECH Manufacturing Initiative (ISMI). Applied is teaming with the centre to improve the environmental performance of its products and processes.
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Citing urgent demand for advanced 300mm capacity, TSMC is to start construction of a new fab, Fab 14, Phase 4, after the Chinese New Year, while Fab 12, Phase 5 expansion is now set for tool install and initial ramp-up in the third quarter of 2010. The new fab is the first 300mm fab officially announced in over a year.
Improvements to its fab in Wilmington, Massachusetts and Limerick, Ireland, have led to higher utilization, shorter lead times and lower manufacturing costs for Analog Devices. The Limerick fab has transitioned all production 200mm wafers, while its Wilmington fab has made a range of operational improvements to lower cost and achieve greater wafer fabrication efficiencies for its proprietary analog, mixed-signal, and MEMS manufacturing process technologies.
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Product Briefing Outline: Applied Materials has unveiled its ‘Applied iSYS’ platform, the industry’s first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. Networked with an Applied process tool, the iSYS system can deliver typical annual savings in power, water and gas consumption equivalent to 200MWh of energy or 220,000 pounds of CO2 emissions, compared to currently available configurations. In addition to having environmental benefits, the iSYS system lowers the utility cost for abatement and vacuum pumping on a process tool by more than 20%.
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One of the equipment suppliers that consistently brings out new products is KLA-Tencor. However, the metrology supplier rarely figures in the most popular rankings in any given year. That has changed in 2008 with its TeraFab tool. Although only released recently, the fifth most popular product was from TEL and Novellus for copper interconnects.
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By Terrence Morris & Steve Blaine PE, CH2M HILL, Oregon, USA
Outside of the process tools themselves, the chilled water plant is typically the single largest consumer of electrical energy in a semiconductor facility. This load includes not just chillers but also cooling tower fans, primary pumps, secondary pumps and condenser pumps. In order to meet the cooling requirements for any particular heat load, many different combinations of this equipment can be run. However, electricity consumption varies considerably depending on the combination of equipment used and the operating levels of the individual components. Selecting the optimal mix of equipment and operating levels presents a substantial challenge for an automatic control system and plant operators. Typically, no method is available to predict the effect of interactions and variations in load demand and outside air. This makes it challenging, if not impossible, to find an equipment mix that achieves optimal energy use. In response to this challenge, we set out to create a model/tool that would allow operators to automatically determine the optimal equipment mix to satisfy cooling requirements and minimize energy use. This paper describes how this model was created and how it works.
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