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300mm Activity Reports
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Dec 17, 2007 at 10:43 AM |
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By Mark Osborne, Editor-in-Chief, Semiconductor Fabtech Continued excess inventories, weak selling prices and only slightly improving fab capacity utilization rates are continuing to dampen officially announced new 300mm fab construction plans. Chip manufacturers are continuing to closely monitor end-market demand before committing to new fab ventures. We focus attention in this report on updating new fab tool install schedules and ramp rate activity trends in the foundry sector. We will also discuss the possible impacts that 300mm Prime and the 450mm wafer campaign may have on 300mm fab activity going forward. Write Comment (0 comments) |
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Sep 06, 2007 at 01:01 PM |
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By Mark Osborne, Editor-in-Chief, Semiconductor Fabtech
ABSTRACT
With over-capacity haunting the memory market and a slow recovery in utilization rates at foundries proving elusive, new 300mm fab announcements have remained tempered in the quarter. A key focus of this repotr concentrates on the dynamics at play at memory manufacturers with regard to new fab announcements, ramp rates, technology migrations and business conditions. Write Comment (0 comments) |
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Jun 13, 2007 at 02:48 PM |
By Mark Osborne, Editor-in-Chief, Semiconductor Fabtech
ABSTRACT
Official new 300mm fab announcements picked up pace in this quarter compared with the previous quarter with a significant number of rumored fabs in the pipeline. Asia continues to be the center of attention, with Intel Corp. dominating the news with its announcement that it will build its first fab in China. Although pure-play foundries had a relatively quiet year, 2007 is set to be rather different. We review new fab announcements, tool install re-scheduling and foundry developments within this report.
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May 02, 2007 at 05:46 PM |
By Mark Osborne, Editor-in-Chief, Semiconductor Fabtech
ABSTRACT
Capital expenditure related to 300mm fab ramps has remained strong throughout
2006; however new fab announcements have declined significantly in the second
half of the year compared with the first. That scenario is expected to reverse in
2007 as a number of new fab announcements are expected, and the number of
first phase tool installs will hit a new record high! Memory fabs are leading the
way with aggressive fab plans, with new builds, ramp rates and in some cases
massive capacity levels far exceeding the current average size of 300mm fabs. This
report therefore focuses on the activity taking place in the memory market that
includes both DRAM & NAND Flash.
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Dec 13, 2006 at 04:24 PM |
By Mark Osborne, Editor-in-Chief, Semiconductor Fabtech
ABSTRACT
New 300mm fab announcements have cooled in comparison with 2Q06, when
nine new fab plans were revealed. This quarter, four fabs were announced but only
two are to start construction in 2006. First phase tool installs are also projected
to be down in the second half of the year compared to first. However, the number
of first phase tool installs are projected to increase sequentially through both
the first and second halves of 2007. Ramp rates are reviewed in some key areas,
highlighting the challenges of aggressive 300mm fab ramps.Write Comment (0 comments) |
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Aug 24, 2006 at 06:35 PM |
Mark Osborne, Editor-in-Chief, Semiconductor Fabtech
ABSTRACT
A significant number (nine) of new 300mm fabs were announced in the quarter with many on short tool install schedules. The new fabs were actually spread across a wide region with a mix of logic, memory and foundry, which does not occur very often. The quarter was also marked by the announcement of one new 300mm fab in Europe, which will tool install in the same year (2007), as last quarter's fab announcement from Intel, something that Europe has not experienced before. This report tracks the increased activity and analyses the new trends taking place as well as tackling growing concerns of looming overcapacity.
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Jun 23, 2006 at 01:40 PM |
Mark Osborne, Editor-in-chief, Semiconductor Fabtech
ABSTRACT
The wave of 300mm fab activity that started in the 3Q05 has continued through to the 1Q06 creating the fifth such wave since 300mm fabs began being constructed. The current wave is expected to continue through to the 1H07 period with at least 15 300mm fabs entering tool install phases in an 18 months cycle. The continued fab expansions in the Asia-Pacific and in particular Taiwan are investigated as well as the key issue concerning the potential for over-capacity in both DRAM and NAND Flash memory as these companies are becoming increasing aggressive with new fab projects. For the first time we analyse in detail the changing capacity dynamics of major chip manufacturers juggling both DRAM and NAND production. We also return to cover the capacity ramps of Intel's 300mm fabs and update on the ongoing developments in the pure-play foundry space.
 300mm activity report: December 2005 to March 2006
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Apr 20, 2006 at 01:12 PM |
ABSTRACT
The lack of new 300mm fab announcements in the first half of 2005 meant only one thing and that was a new round of activity was only a matter of time. The third quarter has turned into a new wave of fab ground breaking and expansions that look set to continue into 2006. Once again the Asia-Pacific region dominated new fab announcements while Intel and Micron kept a certain level of regional balance going. This report highlights in detail the new wave of fabs as well as updating the ongoing ramp rates of all the memory based 300mm fabs. Pure play foundry ramp rates are once again reviewed as the dynamics are continuing to change on a quarterly basis.
28th Edition: 300mm activity report August to November 2005
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Sep 22, 2005 at 01:58 PM |
Editor-in-Chief, Semiconductor Fabtech
ABSTRACT
The big news for the quarter was Intel's announcement of a new 300mm fab.
We take a look at this as well as highlight that more is planned from the company!
Plans rather than actual groundbreaking have also been a strong feature of the
quarter, especially in Taiwan. Activity in Japan is still ongoing while China has
cooled. What's hot is the pure-play foundry space, which is changing faster than
in any other area. This report therefore concentrates on a general round up and
overview of the regional 300mm fab activity for the period and pinpoints the
changes taking place in the foundry sector.
300mm activity report: May to July 2005
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Sep 22, 2005 at 01:51 PM |
Mark Osborne, Editor-in-Chief, Semiconductor Fabtech
ABSTRACT
The softening in IC sales and the concern surrounding the rapid rise in inventory
in the second half of 2004 has had an impact on fab activity in the first quarter of
2005. The intoxicating level of 300mm fab announcements experienced in 2004
have so far failed to reappear in 2005. No new 300mm fabs have been announced
in the period covered within this report. This is perhaps both a sign of the current
cautious approach to fab expansions by leading chip manufacturers as well as an
obvious period of digestion. The year may well become characterised by a lack
of new fab announcements. We take a look at key companies such as Intel that
could still be in the planning stages for new fabs. We also investigate the fears
concerning over-capacity looming in the memory market, which is now dominated
by 300mm wafer manufacturing.
300mm activity report: January to April 2005
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Feb 01, 2005 at 09:54 AM |
As 2004 came to a close, concern within the
industry focused on the softening of IC global demand and the growing
threat of over-capacity that could trigger another downturn. Taking a
rough cut of end of year market analyst's projections it would seem we
are heading for a static or at best low digit figure growth in 2005. In
stark contrast to this softening business environment, 300mm fab
activity has set a record pace in 2004 and perhaps even more
surprisingly, 2005 looks set to be the break the 2004 record. We track
all the major movements for this quarter and provide insight into the
2005 big build, as well as providing updates to capacity ramp rates
within 300mm fabs around the world. 300mm activity report: October to December 2004 |
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Oct 01, 2004 at 12:48 PM |
With the semiconductor industry reaching the peak of the current
up-turn a significant number of 300mm fabs will come online in 2004.
Currently, the number of fabs preparing to tool install during 2005 is
closely tracking the record number expected in 04. This activity report
will cover in-depth, the trends now taking place and the potential
impact in the 2005 period. Updates are also given on the battle for
300mm capacity in the foundry market as well as ramp rate analysis of
fabs dedicated to memory production.
24th Edition: 300mm activity report: July to September 2004 & trends update
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Jul 01, 2004 at 12:00 AM |
New 300mm fab announcements in the quarter have
come on the back of a host of capacity ramps at existing facilities.
The production ramps were to be expected as we have seen very robust
demand for IC's in almost all market sectors - something not seen since
1999! Worldwide semiconductor revenue will rise to $226.5 billion in
2004, up 24.4 percent from $182 billion in 2003, according to iSuppli's
newly revised forecast. What was a surprise was the announcements by
Elpida and Intel that they would start construction of new fabs almost
straight away. Concern about over capacity in the memory market with
Elipda's monster fab (60,000wspm), Infineon's fit-out of its Richmond
fab and overall memory manufacturers ramping strategies seem to be
leading to an obvious conclusion. This report runs through the activity
events of the quarter and provides some further insight into AMD's Fab
36, which had its topping-off ceremony in this period.
02 - 300mm activity report: April to July 2004
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300mm Activity Reports 
