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Top Story

Elpida breaks-up monolithic memory mega-fab

01 July 2009 | Fab Management
Elpida Memory, which operates one of the world’s largest DRAM memory fabs in Hiroshima, Japan, will undergo a major internal transformation as the company battles a continued over capacity in the memory markets and seeks Japanese Government funds to continue operations. Elpida said it would divide the massive facility into two separate lines, one dedicated to mobile device-related DRAM and the other to PC related DRAM devices. Both lines will have their own management teams and operate separately, the company said. Read more >>

News

Semiconductor sales climb 5.4% in May

03 July 2009 | Fab Management
A third-consecutive month of growth in semiconductor sales has the SIA cautiously optimistic about an industry recovery, though shied away from calling the next upturn. Worldwide sales of semiconductors in May rose to US$16.5 billion, an increase of 5.4% from April’s figure of US$15.6 billion. Read more >>

DNP and Molecular Imprints lowering costs, speeding development together

02 July 2009 | Lithography
DNP LogoDai Nippon Printing (DNP), producer of semiconductor photomasks, and Molecular Imprints, producer of nanopatterning systems and solutions, are collaborating to speed production of nanoimprint lithography for high-volume semiconductor device manufacturing. DNP is the official provider of funds and support for Molecular Imprints to develop a new mask replication platform aimed at lowering the cost of imprint masks. Read more >>

SUSS MicroTec reworks sales structure in Asia

02 July 2009 | Wafer Processing
SUSS HQSUSS MicroTec, supplier of process and test solutions for microstructuring applications in semiconductor markets, is changing the structure of its sales in Asia and basing the new office in Singapore. ZMC Technologies will act as general sales representative for interests in Malaysia, Singapore and the Philippines. This adds to SUSS MicroTec’s presence in Seoul, Shanghai, Yokohama, and Hsinchu. Read more >>

300mm equipment at Qimonda’s Dresden fab being sold

02 July 2009 | Cleanroom

Tool order: Umicore selects Eyelit’s MES suite for germanium wafer production

01 July 2009 | Fab Management

Applied Materials shifts IT support from Satyam to IBM

30 June 2009 | Fab Management | Comments (2)

Semilab buys another metrology company

30 June 2009 | Wafer Processing

SMIC yields on first HiPo 45nm wafer lots

30 June 2009 | Wafer Processing

Editor's Blog & Chip Shots

Reducing the cost and impact of innovation

02 July 2009 | Editor's Blog
r. Dirk Ortloff, is Co-founder and Chief Technology Officer at Process Relations GmbH.Dr. Dirk Ortloff, is Co-founder and Chief Technology Officer at Process Relations GmbH. Here he discusses the advantages of investing in new technologies and methodologies during the economic downturn as a guest columnist. Read more >>

Where’s the fab capacity needed in 2010?

22 June 2009 | Editor's Blog | Comments (2)
TSMC Fab 14 expansion As a direct follower of the move to 300mm fabs, the lack of new build in 2008 and that expected in 2009 looks set to cause a serious capacity constraint over the next two years as the industry recovers from one of the worst downturns in its history. In his May, 2009 monthly report, Malcolm Penn at Future Horizons believes the capacity shortage at 300mm fabs will impact the industry as soon as 2010. He claims that only 40,000 200mm wafer starts/week equivalent, minus any capacity closures, will come on stream next year, based on the incredibly low capital spending levels. Read more >>

Goodbye Moore’s Law, hello Len’s Law

18 June 2009 | Editor's Blog

When demotion is a promotion

15 June 2009 | Editor's Blog

ASM’s Levitor RTP technology rises from the ashes

10 June 2009 | Editor's Blog | Comments (1)

It’s all up from here, according to IC Insights

02 June 2009 | Editor's Blog

Think quarterly, stupid

14 April 2009 | Editor's Blog | Comments (2)

Latest Jobs

Sun Chemical: Photovoltaic Device Scientist

18 June 2009 - Carlstadt, New Jersey, USA

Applied Materials: PECVD Process Engineer - SunFab

04 June 2009 - California, USA

Applied Materials: Process Integration and Yield Engineer

21 May 2009 - Santa Clara, California, USA

EBARA Technologies: Third Party Repair Technician

07 May 2009 - Sacramento, California, USA

AdvanceSis Ltd.: Senior Electrical Engineer - Photovoltaic Systems

30 April 2009 - Coventry, England

Going Places

Amkor plans executive reshuffle as COO Ken Joyce takes the helm

30 June 2009
James KimAmkor Technology, Inc. has announced its plans for an executive shake-up on October 1st, as it revealed that company CEO and founder James Kim (pictured) will become Executive Chairman of the Board of Directors and Ken Joyce, President and COO, will take the reins as well as a seat on the board of directors. The succession has been on the cards for some time, according to the company. Read more >>

New fab 2 executive leadership team for Globalfoundries

25 June 2009
Globalfoundries buildingGlobalfoundries has announced two new members of its executive team: Norm Armour, newly-elected vice president and general manager, and Eric Choh, vice president of operations. The company is setting up shop for the development of Fab 2 at the Luther Forest Technology Campus in New York, its newest semiconductor fabrication facility. Read more >>

SanDisk’s Eli Harari to receive IEEE Robert N. Noyce Medal

24 June 2009

Eli HarariSanDisk Corp. has announced that it will be awarding its co-founder, chairman and CEO Eli Harari the IEEE Robert N. Noyce Medal at the IEEE Honours Ceremony due to be held in Los Angeles on June 25th.

Read more >>

Product Briefings

New Product: New XP upgrade for KLA-Tencor’s 28xx defect inspection systems boosts sensitivity

02 July 2009 | Lithography
Product Briefing Outline: KLA-Tencor has announced XP, a new upgrade package for 28xx broadband brightfield inspection systems. The XP package is the first commercially available product to give an inspection system access to standard IC design layout files. With access to this information, the inspection system can use knowledge of the defect’s location within the circuit to better estimate its probability of affecting device yield. In addition, XP can use the results of the design-aware wafer inspection to identify features on the mask that may be particularly sensitive to process variations during printing. These and other features of the XP upgrade package are designed to improve the sensitivity and productivity of existing 28xx inspectors and raise the information content of defect results, helping to accelerate identification and resolution of defect issues. Read more >>

New Product: Nova’s ‘MatMaker,’ solution significantly cuts optical CD measurement time

02 July 2009 | Wafer Processing
Product Briefing Outline: Nova Measuring Instruments has launched ‘MatMaker,’ a Product-Driven Materials Characterization package, which is based on software algorithms and tools refined by Nova’s applications developers over the past 10 years. The company claims the new software changes the way spectral Optical CD is deployed in fabs, significantly reducing application development time and cost while at the same time increasing the measurement accuracy. Read more >>

New Product: SOKUDO DUO track system boost throughput to 250-300 wafers per hour

25 June 2009 | Lithography
Product Briefing Outline: Sokudo Co., Ltd. has recently launched the SOKUDO DUO platform, a new concept in photoresist coat/develop track systems that provides customers with the ultra-high productivity needed to optimize leading-edge lithography processing. Incorporating an innovative dual track design, the system simultaneously processes wafers in two lines, claimed to boost throughput to 250-300 wafers per hour (wph), depending on system configuration, while also improving uptime and substantially reducing system footprint. Read more >>

Recruitment News

Axcelis cuts one-fifth of global workforce

22 May 2009
Further to its approximately 14% cut in staff numbers in October 2008 – only seven months ago, Axcelis Technologies, Inc. has again announced that it is letting staff go in a further attempt at cutting operating costs to stay competitive. Approximately 235 staff, or 20% of its global workforce will be axed from the company’s books, yielding an estimated $25 million in savings per annum. Read more >>

Xilinx looks to restructuring

16 April 2009
Xilinx semiconductor plant in DublinXilinx, Inc. has announced plans to restructure the company, including getting rid of 6% of its workforce, or 200 employees, which would have a pre-tax charge of US$11-US$13 million for the June quarter, mostly dealing with severance pay expenses. Read more >>

Qimonda Portuguese subsidiary cuts 1,000

16 April 2009
Qimonda PortugalQimonda AG has announced it will be cutting 1,000 employees from its Portuguese unit, while also suspending the contracts of the 800 remaining workers for the next six months.  This unit had stopped production last month, since parts from Dresden’s Qimonda factory failed to ship. Read more >>

Special Features

300mm activity report: Special Memory Focus

01 March 2008
Mark Osborne, Editor-in-Chief, Semiconductor Fabtech Read more >>

300mm activity report: January to April 2008

01 March 2008 | Comments (1)
Mark Osborne, Editor-in-Chief, Semiconductor Fabtech Read more >>

300mm Prime and the road to 450mm: Part 1

01 December 2007 | Comments (1)
Mark Osborne, Editor-in-Cheif, Semiconductor Fabtech Read more >>