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The jointly developed ‘PROVE’ overlay metrology system between Carl Zeiss and SEMATECH has successfully passed a key development milestone, according to the partners. The system has achieved .5nm repeatability and 1.0nm accuracy in image placement, registration and overlay measurement for double patterning photomasks, a key requirement for extending 193nm ArF lithography to the 32nm node and below. Read more >>

In a renewed effort to add capacity ahead of the curve and return to historical capital spending patterns, TSMC has held a groundbreaking ceremony in Taichung’s Central Taiwan Science Park for its latest 300mm facility, Fab 15. The fab will be comprised of two manufacturing cleanrooms and an office building having a capacity of over 100,000wspm when fully ramped. Construction is expected to take approximately 10 months. TSMC said it expected to begin equipment move in for Phase 1 in June 2011, with volume production of 40nm and 28nm technology products for customers in the first quarter of 2012. The fully ramped cost of the facility was said to be US$9.34 billion. Read more >>

Process yield problems are to blame for a slight delay in new microprocessor shipments from AMD, using GlobalFoundries 32nm process, according to Dirk Meyer, President and Chief Executive Officer of AMD. In a conference call with financial analysts to discuss second quarter results, 32nm devices would start shipping and generating revenue in the fourth quarter of 2010, not in the third quarter as previously guided. The yields were not where they expected them to be in the quarter and meant they were unable to ramp production as planned.
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Product Briefing Outline: Applied Materials has launched the ‘Applied UVision’ 4 wafer inspection system, enabling IC manufacturers to detect yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. UVision 4 extends Applied’s DUV laser imaging technology to deliver the sensitivity and productivity needed to rapidly locate and identify defects previously unseen by any other inspection system. The UVision 4 system is already the tool of record at multiple leading flash manufacturers where it is used for 32nm production and in the development of 22nm and EUV lithography processes. Read more >>

Product Briefing Outline: Applied Materials has added to its line of 3D chip packaging solutions with the launch of its ‘Applied Producer InVia’ dielectric deposition system. Using a unique CVD process and chemistry, the InVia system deposits the critical oxide liner film layer in high aspect ratio (HAR) through-silicon via (TSV) structures. Providing conformal coverage over the full depth of these challenging features, the InVia process enables robust electrical isolation of the TSV – which is vital for reliable device performance.  Read more >>

Product Briefing Outline: Crossing Automation has announced that it has improved its Spartan equipment front end module (EFEM) performance, enabling it to achieve 450 wafers per hour (wph) throughput. By upgrading Spartan’s production-proven software algorithms for wafer move paths, Crossing Automation now has the highest throughput capability of any commercially available EFEM, while maintaining Spartan’s established reliability and cleanliness performance. Read more >>

Mark Osborne, Editor-in-Chief, Semiconductor Fabtech Read more >>

Mark Osborne, Editor-in-Chief, Semiconductor Fabtech Read more >>

Mark Osborne, Editor-in-Cheif, Semiconductor Fabtech Read more >>